Halnziye thermal compound is a top brand in China and around the world.
This heatsink thermal compound is a white paste silicone product which is heavily filled with metal oxides. The incorporation of highly efficient heat-conductive metal oxides promotes high thermal conductivity, low bleeding, and high-temperature stability. This formula remains stable even with extreme temperature changes and helps to maintain a positive heat sink seal that improves heat transfer.
Application: Suitable for modern high performance CPU, GPU, and Chipset heatsink interface. Each pack contains 0.5 grams of material which is enough for to install 3+ processor heatsinks.
MFG Halnziye
MPN HY410
Certifications: SGS, ROHS, REACH, PFOS
Specifications:
Parameter |
Units |
Condition |
Test methods |
Test result |
Color |
N/A |
25°C |
Visual |
White |
Thermal Conductivity |
W/m-K |
N/A |
ROCT8.140-82 |
>1.42 |
Thermal Impedance |
°C-in2/W |
25°C |
ASTM D1470 |
>0.252 |
Specific Gravity |
g/cm^3 |
25°C |
ASTM D1475 |
>2.3 |
Evaporation |
% |
150°C/24Hours |
Fed.Std.791 |
<0.001 |
Moment Bore Temp |
°C |
____ |
____ |
-50~300 |
Operation Temp |
°C |
____ |
____ |
-30~280 |
Viscosity |
N/A |
25°C |
____ |
1000 |
Thixotropic Index |
1/10 mm |
25°C |
GB/T-269 |
380+/-10 |
Ingredients:
Silicone Compounds: 35%
Carbon Compounds: 45%
Metal Oxide Compounds: 20%
Brand | Best Byte |
---|---|
Manufacturer Part # | HY410 |
RoHS Compliance | Yes |
Color | White |
SKU | COTIHZBP05 |