Halnziye Heatsink Compound CPU Thermal Grease Single Use Blister Soft Pak 0.5 gram Net

Low cost thermal compound with excellent performance and long term stability at a wide range of operating temperatures. 0.5 gram net weight blister packaging is sufficient material for several CPU applications.

Brand
Color
- White
RoHS Compliant
- Yes
MPN
- HY410

Same-day shipping on orders placed Mon–Fri before 2 PM CST
Ships from Katy, Texas
Sold & shipped by Best Byte Computers
Purchase orders welcome · Ask for a quote

Halnziye thermal compound is a top brand in China and around the world.

This heatsink thermal compound is a white paste silicone product which is heavily filled with metal oxides. The incorporation of highly efficient heat-conductive metal oxides promotes high thermal conductivity, low bleeding, and high-temperature stability. This formula remains stable even with extreme temperature changes and helps to maintain a positive heat sink seal that improves heat transfer.

Application: Suitable for modern high performance CPU, GPU, and Chipset heatsink interface. Each pack contains 0.5 grams of material which is enough for to install 3+ processor heatsinks.

MFG Halnziye
MPN HY410

Certifications: SGS, ROHS, REACH, PFOS

Specifications:

Parameter	Units	Condition	Test methods	Test result
Color	N/A	25°C	Visual	White
Thermal Conductivity	W/m-K	N/A	ROCT8.140-82	>1.42
Thermal Impedance	°C-in2/W	25°C	ASTM D1470	>0.252
Specific Gravity	g/cm^3	25°C	ASTM D1475	>2.3
Evaporation	%	150°C/24Hours	Fed.Std.791	<0.001
Moment Bore Temp	°C	____	____	-50~300
Operation Temp	°C	____	____	-30~280
Viscosity	N/A	25°C	____	1000
Thixotropic Index	1/10 mm	25°C	GB/T-269	380+/-10

Ingredients:

Silicone Compounds: 35%
Carbon Compounds: 45%
Metal Oxide Compounds: 20%

Specifications

Brand	Best Byte
Color	White
RoHS Compliant	Yes
MPN	HY410