Specifications o Mfr Part Number: MX-2 o Application: CPU, GPU and other applications between power semiconductor components and heat sinks.
o Features: High Thermal Conductivity Low Thermal Resistance Non-Electrical Conductive Non-Capacitive Non-Curing Non-Corrosive No Bleeding Odorless o Density: 3.69 g/ cm3 o Viscosity: 2850 poise o Net Weight: 30 g