Intel Pentium 4 Socket 478 Heatsink Retention Module Bracket, Steel

Intel Pentium 4 Socket 478 Heatsink Retention Module Bracket, Steel

Halnziye Heatsink Compound CPU Thermal Grease Single Use Blister Soft Pak 0.5 gram Net

Low cost thermal compound with excellent performance and long term stability at a wide range of operating temperatures. 0.5 gram net weight blister packaging is sufficient material for several CPU applications.
$0.19
Availability: In stock
SKU
COTIHZBP05
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Halnziye thermal compound is a top brand in China and around the world.

This heatsink thermal compound is a white paste silicone product which is heavily filled with metal oxides. The incorporation of highly efficient heat-conductive metal oxides promotes high thermal conductivity, low bleeding, and high-temperature stability. This formula remains stable even with extreme temperature changes and helps to maintain a positive heat sink seal that improves heat transfer.

Application: Suitable for modern high performance CPU, GPU, and Chipset heatsink interface. Each pack contains 0.5 grams of material which is enough for to install 3+ processor heatsinks.

MFG Halnziye
MPN HY410

Certifications: SGS, ROHS, REACH, PFOS

Specifications:

Parameter

Units

Condition

Test methods

Test result

Color

N/A

25°C

Visual

White

Thermal Conductivity

W/m-K

N/A

ROCT8.140-82

>1.42

Thermal Impedance

°C-in2/W

25°C

ASTM D1470

>0.252

Specific Gravity

g/cm^3

25°C

ASTM D1475

>2.3

Evaporation

%

150°C/24Hours

Fed.Std.791

<0.001

Moment Bore Temp

°C

       ____

____

-50~300

Operation Temp

°C

____

____

-30~280

Viscosity

N/A

25°C

____

1000

Thixotropic Index

1/10 mm

25°C

GB/T-269

380+/-10

Ingredients:

Silicone Compounds: 35%
Carbon Compounds: 45%
Metal Oxide Compounds: 20%

More Information
Brand Best Byte
Manufacturer Part # HY410
RoHS Compliance Yes
Color White
SKU COTIHZBP05
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You're reviewing:Halnziye Heatsink Compound CPU Thermal Grease Single Use Blister Soft Pak 0.5 gram Net